MIT Lincoln Laboratory RF PCB Designer in Lexington, Massachusetts
The RF Technology Group develops and demonstrates innovative radio-frequency (RF) technologies and integrated subsystems as solutions to emerging national security needs in radar, electronic warfare, signals intelligence (SIGINT), and special communications. To execute its RF research and development mission, the group develops and tests novel RF solutions at the device and semiconductor level up through the full RF subsystem level, with an emphasis on highly integrated, small-form-factor RF subsystems. The group collaboratively interacts with research groups across the Laboratory to take projects from initial concept stage, through simulation and analysis, to design and prototyping, and finally to field demonstration.
The RF Technology group seeks a full-time senior level RF printed circuit board designer for schematic capture and printed circuit board layout of RF and mixed signal circuits. The position associated with the requisition will support the development of RF, microwave, and high speed digital systems throughout the printed circuit board design, fabrication, assembly, and verification process. This work will include but not be limited to, selection of parts, development and verification of parts libraries, schematic capture, board layout, design documentation, and interfacing with fabrication and assembly houses. Experience with layout and familiarity with manufacturing processes for multi-layered circuit boards at 18+ GHz is required. Knowledge of manufacturing design rules and ability to design around tight tolerances are necessary. Experience working with fabrication and assembly houses to maximize yield on difficult printed circuit board designs is highly desired. Work will be in an environment with flexibility in design processes including unconventional board configurations and design flows, including working designs from a block diagram level. Experience adding innovative techniques to a board design group is also highly desirable.
A successful candidate will be comfortable working in an innovative and mission-driven engineering group to accommodate changing demands. They may often have to multi-task and must demonstrate strong initiative and problem-solving skills, and be able to independently research solutions to new design and manufacturing challenges. Good estimating and time-management skill is necessary to meet critical schedules. Must be able to communicate clearly to teammates, administrators, and outside vendors; the ability to create graphic and text presentations about the work for wider audiences is a plus.
Two-year degree in Electro/Mechanical design from an accredited technical institute or its equivalent and/or 10+ years of RF and mixed signal PCB layout experience required. Must have significant experience with DxDesigner and Expedition Enterprise PCB tools from Mentor Graphics, with working knowledge of CES and Library Manager. Experience with Autocad, Solidworks, and other CAD software is desirable. Certifications and involvement with the IPC, knowledge of IEEE and MIL-Specs, experience with fabrication and assembly processes strongly preferred.
For Benefits Information, click http://hrweb.mit.edu/benefits
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
To safeguard our health and well-being, MIT Lincoln Laboratory requires COVID-19 vaccination for all employees. Individuals may request exemption from the vaccine requirement for medical or religious reason.
MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
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