MIT Lincoln Laboratory Compound Semiconductor Process Engineer in Lexington, Massachusetts
When NASA made history in 2013 with the longest laser communication link ever demonstrated (from a Moon-orbiting satellite to Earth), our group was behind the satellite's laser transmitter and the ground terminals' highly sensitive photon detectors that enabled the link. We have a long history of developing advanced solid-state, fiber, and diode laser technologies for the scientific and defense communities. Recently, our lasers have been key to enabling cutting-edge ladar systems that can map terrain with greater accuracy and area coverage rates, providing much needed capabilities in disaster relief efforts, such as the disaster mapping of Hurricanes Harvey and Irma in 2017. We are also creating cryogenic-laser-based illuminators for airborne sensors that can detect and track fast-moving objects with highly dynamic platform motion. Finally, we've led the laser community in developing beam-combining techniques for high-energy laser systems. Using these techniques, our fiber laser system have demonstrated record-breaking levels of beam brightness and near-ideal beam quality. In 2022 and beyond, we continue to push the envelope of laser technology across a very broad range of wavelengths.
The Laser Technology and Applications Group seeks an individual to support the development and fabrication of compound semiconductor optoelectronic devices. These devices find applications in a wide range of systems including directed energy, lidar, sensing, and communications. Example devices include high-power diode and quantum cascade lasers, optical amplifiers, high-current waveguide photodiodes, wideband optical modulators, and photonic integrated circuits. Fabrication of these devices involves leveraging InP, GaAs, and GaN material systems and their associated compositions. The successful candidate will be a member of a multi-disciplinary team whose mission is to develop packaged prototypes of advanced devices and integrated subsystems.
Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
5 or more years of experience in the fabrication of compound-semiconductor (III-V) devices
Direct experience with compound semiconductor fabrication equipment and processes for device production, e.g., lithography, wet etching and component preparation, reactive-ion etching, sputtering and e-beam deposition of metal and dielectric materials, wafer and device cleaving
Experience working in a clean room laboratory, either in educational or professional settings
Excellent documentation and communication skills
10 or more years of experience in the fabrication of compound-semiconductor (III-V) devices
Experience with device design and layout software, such as L-Edit or KLayout
Experience with fabrication planning and team management
Experience in both research laboratory and industrial production environments
Familiarity with the interplay between III-V device fabrication, packaging and performance
Familiarity with chemistry, electrical and optical characterization techniques, packaging approaches, and epitaxial material growth is a plus
At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include:
Comprehensive health, dental, and vision plans
Paid leave (including vacation, sick, parental, military, etc.)
Tuition reimbursement and continuing education programs
A range of work-life balance options
... and much more!
Please visit our Benefits page (https://hr.mit.edu/benefits) for more information. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts and perks (https://hr.mit.edu/benefits/additional) .
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
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